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1 July 2002 Fabrication challenges for next-generation devices: MEMS for rf wireless communications
David E. Seeger, Jennifer Lund, Christopher Jahnes, Lili Deligianni, Paivikki Buchwalter, Panayotis C. Andricacos, Raul E. Acosta, Inna V. Babich, Arpan P. Mahorowala, Joanna Rosner, John Cotte
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Proceedings Volume 4688, Emerging Lithographic Technologies VI; (2002) https://doi.org/10.1117/12.472298
Event: SPIE's 27th Annual International Symposium on Microlithography, 2002, Santa Clara, California, United States
Abstract
With wireless communications becoming an important technology and growth engine for the semiconductor industry, many semiconductor companies are developing technologies that differentiate themselves in this space. One means of accomplishing this goal is to find a way to integrate passive components, which currently make up over 70 percent of the discrete components in a wireless handset today, directly on-chip thereby greatly simplifying handsets. While a number of technologies are being investigated to allow on- chip integration, MEMS technologies are an important part of this development effort. They have been used to create switches, filters, local oscillators, variable capacitors and high quality factor inductors to name a few examples. The lithography requirements for these devices are very different than those found in standard semiconductor fabrication with the most importatnt involving pattern over extreme topography. In this paper, we discuss some of the fabrication challenges for these devices as well as some approaches that have been demonstrated to satisfy them.
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David E. Seeger, Jennifer Lund, Christopher Jahnes, Lili Deligianni, Paivikki Buchwalter, Panayotis C. Andricacos, Raul E. Acosta, Inna V. Babich, Arpan P. Mahorowala, Joanna Rosner, and John Cotte "Fabrication challenges for next-generation devices: MEMS for rf wireless communications", Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); https://doi.org/10.1117/12.472298
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KEYWORDS
Microelectromechanical systems
Switches
Lithography
Resonators
Semiconductors
Electrodes
Capacitors
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