Paper
15 October 2001 High-aspect-ratio PMMA microstructures fabricated by RIE
Aibin Yu, Guifu Ding, Chunsheng Yang, Changmin Li, Haiping Mao, Zhiping Ni
Author Affiliations +
Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444692
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
RIE is a promising way to fabricate high aspect ratio micro-structures and the PMMA is a widely used thick resist. In this paper, we developed a reactive ion etching of PMMA process in O2 plasma to fabricate micro-structures. High etch rate(0.5 micrometers /min) and smooth surface were achieved. In order to get high selectivity, We use Ni film as mask, which was patterned by photochemical etching. The etch results showed that vertical etch profile(base angle>88 degree(s)), high aspect ratio (5:1) and through-out etching of PMMA(100micrometers in thickness) could be obtained if select optimum etching conditions. We also found that the self-bias is one of the critical parameters during the process. If etching power was too high, the surface would be deformed due to the high energetic particles bombardment
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aibin Yu, Guifu Ding, Chunsheng Yang, Changmin Li, Haiping Mao, and Zhiping Ni "High-aspect-ratio PMMA microstructures fabricated by RIE", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); https://doi.org/10.1117/12.444692
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Cited by 2 scholarly publications.
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