Paper
15 October 2001 Effect of microstructure of TiNi/Si diaphragm on thermal-actuating performance
Xiulan Cheng, Dong Xu, Jian Chen, Bingchu Cai, Guifu Ding
Author Affiliations +
Proceedings Volume 4601, Micromachining and Microfabrication Process Technology and Devices; (2001) https://doi.org/10.1117/12.444730
Event: International Symposium on Optoelectonics and Microelectronics, 2001, Nanjing, China
Abstract
TiNi/Si diaphragm is a useful selection for reciprocating motion microactuator, since it needn't complex bias structure and special thermal-mechanical training. The TiNi/Si actuating diaphragm with patterned TiNi resistance strip can improve the dynamic response effectively. The several kinds of pattern of TiNi thin films with various shapes and sizes were designed and processed, and the influences of patterning and Si thickness on the characteristics of phase transformation were analyzed by measuring electrical resistance-temperature curves. Moreover, the stress distributions and maximum deflections of TiNi/Si diaphragms with different Si thickness were simulated by FEA. The results show that the phase transformation behaviors of the TiNi thin films with different Si thickness and various patterns are different. Based on these results, optimized actuating diaphragm with patterned TiNi/Si structure was developed. The thermal actuating results are agreed with simulating results of FEA.
© (2001) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiulan Cheng, Dong Xu, Jian Chen, Bingchu Cai, and Guifu Ding "Effect of microstructure of TiNi/Si diaphragm on thermal-actuating performance", Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); https://doi.org/10.1117/12.444730
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