Micro-CT for nondestructive 3D reconstruction of MEMS and sensors

Alexander Sasov

doi:10.1117/12.425326

30 April 2001 Micro-CT for nondestructive 3D reconstruction of MEMS and sensors

Alexander Sasov

Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425326
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

The combination of x-ray microscopy with tomographical reconstruction allows getting 3D information about the internal microstructure by a non-destructive way. A desktop high- resolution X-ray micro-CT (microtomograph) has been developed for 3D reconstruction and realistic visualization of the internal microstructure with spatial resolution in the micron range. The instrument was successfully tested for inspection, defectoscopy and back engineering in MEMS and integrated multichip sensors.

Citation Download Citation

Alexander Sasov "Micro-CT for nondestructive 3D reconstruction of MEMS and sensors", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425326

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