3D-CSP: an innovative packaging method based on RMPD

Helge Bohlmann; Reiner Goetzen; Andrea Reinhardt

doi:10.1117/12.425300

30 April 2001 3D-CSP: an innovative packaging method based on RMPD

Helge Bohlmann, Reiner Goetzen, Andrea Reinhardt

Proceedings Volume 4407, MEMS Design, Fabrication, Characterization, and Packaging; (2001) https://doi.org/10.1117/12.425300
Event: Microelectronic and MEMS Technologies, 2001, Edinburgh, United Kingdom

Abstract

A major bottleneck in the applications of microtechnologies are packaging and interconnection techniques. 3D-CSP (3D-Chip-Size- Packaging), which is based on RMPD^TM, solves an extremely wide range of packaging problems. RMPD^TM and 3D-CSP are discussed and applications presented.

Citation Download Citation

Helge Bohlmann, Reiner Goetzen, and Andrea Reinhardt "3D-CSP: an innovative packaging method based on RMPD", Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); https://doi.org/10.1117/12.425300

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