W-CMP alignment using ASML's ATHENA system on an I-line stepper

K. John Prasad; D. Arunagiri Rajan; Yew-Kong Tan; Gin Ping Sun; Stephen Morgan; Merritt Phillips; Bruce Ng

doi:10.1117/12.436730

22 August 2001 W-CMP alignment using ASML's ATHENA system on an I-line stepper

K. John Prasad, D. Arunagiri Rajan, Yew-Kong Tan, Gin Ping Sun, Stephen Morgan, Merritt Phillips, Bruce Ng

Proceedings Volume 4344, Metrology, Inspection, and Process Control for Microlithography XV; (2001) https://doi.org/10.1117/12.436730
Event: 26th Annual International Symposium on Microlithography, 2001, Santa Clara, CA, United States

Abstract

This paper demonstrates the overlay capability of ASML's ATHENA alignment system on I-line steppers for W-CMP processes. The evaluation presents the method used to find the best scribe-line marks, alignment recipe and the long term overlay capability of ATHENA for a 0.35micrometers device in a production environment. This alignment capability for W-CMP meets the overlay requirement for the 0.35micrometers process and thus leads to device yield improvement.

Citation Download Citation

K. John Prasad, D. Arunagiri Rajan, Yew-Kong Tan, Gin Ping Sun, Stephen Morgan, Merritt Phillips, and Bruce Ng "W-CMP alignment using ASML's ATHENA system on an I-line stepper", Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); https://doi.org/10.1117/12.436730

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