Crosstalk in packaging array-based optical interconnects and processors

Anjan K. Ghosh

doi:10.1117/12.404881

23 October 2000 Crosstalk in packaging array-based optical interconnects and processors

Anjan K. Ghosh

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404881
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

Parallel optical interconnections which replace metallic transmission lines with optical fibers or free space channels provide high throughput, easy system integration, and low latency. Such interconnects are used in the design of multiprocessors and telecommunication central office switches and routers. In all parallel optical interconnects we need to couple a set of laser beams coming out of an array of sources or passing through an array of optical devices to another array of optical devices. Owing to diffraction laser beams spread spatially. So some optical devices in the path of laser beam may receive power from adjacent channels. The power form adjacent channels gives rise to crosstalk noise. In this paper we quantify the amount of optical crosstalk that can corrupt a channel in 2D rectangular arrays of parallel optical interconnects. The worst case signal to crosstalk power ratio in an array of interconnects is calculated as a function of the sizes of the array elements, inter-element spacing and distances. From the analytical results in this paper it is possible to determine guidelines on packaging optical interconnects, free-space or optical fiber-based. The effects of built-in offsets on the crosstalk power can be quantified. The results of this paper are also useful in optimizing the design of various types of extrinsic optical sensors in which cross-coupling or crosstalk is the basis of the sensing process.

Citation Download Citation

Anjan K. Ghosh "Crosstalk in packaging array-based optical interconnects and processors", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404881

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