Bulk micromachining of SOI wafers using double-sided lithography and anisotropic wet etching

Henrik Rodjegard; Gert I. Andersson

doi:10.1117/12.396469

25 August 2000 Bulk micromachining of SOI wafers using double-sided lithography and anisotropic wet etching

Henrik Rodjegard, Gert I. Andersson

Proceedings Volume 4174, Micromachining and Microfabrication Process Technology VI; (2000) https://doi.org/10.1117/12.396469
Event: Micromachining and Microfabrication, 2000, Santa Clara, CA, United States

Abstract

A novel method of manufacturing bulk micromachined components in SOI material with anisotropic wet etching is presented. The SOI material reduces the total chip size compared to standard bulk micromachining since the slopes are shorter. It also adds functionality to the components, such as inherent overload protection and squeezed air-film damping. The method is based on double sided lithography and anisotropic wet etch of the thin device layer of the SOI wafer. The lithography on the back of the buried oxide is carried out either by electro deposition of the photoresist PEPR 2400 or by spraying ma-P 215S. A highly symmetric three-axis accelerometer has successfully been manufactured in a 50 micrometers thick SOI film.

Citation Download Citation

Henrik Rodjegard and Gert I. Andersson "Bulk micromachining of SOI wafers using double-sided lithography and anisotropic wet etching", Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); https://doi.org/10.1117/12.396469

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