Assessing polylayer performance of UV defect detection systems

James A. Reynolds

doi:10.1117/12.392085

19 July 2000 Assessing polylayer performance of UV defect detection systems

James A. Reynolds

Proceedings Volume 4066, Photomask and Next-Generation Lithography Mask Technology VII; (2000) https://doi.org/10.1117/12.392085
Event: Photomask and Next Generation Lithography Mask Technology VII, 2000, Kanagawa, Japan

Abstract

Integrated circuit (IC) production is dependent on the ability of semiconductor manufacturers to obtain reticles which are free of printable defects. One key step in making such reticles is defect inspection. This process has two steps; locating reticle defects with an inspection system and classifying them accurately. Both techniques have been in place for many years, but the ability to assess the combined reliability of the scanning and classification procedures has not because of the pattern simplicity and defect predictability in most test reticles. To better evaluate the accuracy of scanning and classification, a new test reticle was designed with the line-widths, the complex geometries and the look-and-feel of a real-world, state-of- the-art, poly layer reticle. Programmed defects were place at varying locations in the native pattern to emulate more closely production reticle inspection. This poly defect test reticle was inspection in state-of-the-art mask facilities using three different advanced ultra violet reticle defect inspection systems and then classified by experienced personnel. The observed classification accuracy was high but inconclusive. The most significant result from this work was that there are large differences in defect scanning sensitivity between the three systems checked.

Citation Download Citation

James A. Reynolds "Assessing polylayer performance of UV defect detection systems", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); https://doi.org/10.1117/12.392085

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