150-nm DR contact holes die-to-database inspection

Shen Chung Kuo; Clare Wu; Yair Eran; Wolfgang Staud; Shirley Hemar; Ofer Lindman

doi:10.1117/12.392072

19 July 2000 150-nm DR contact holes die-to-database inspection

Shen Chung Kuo, Clare Wu, Yair Eran, Wolfgang Staud, Shirley Hemar, Ofer Lindman

Proceedings Volume 4066, Photomask and Next-Generation Lithography Mask Technology VII; (2000) https://doi.org/10.1117/12.392072
Event: Photomask and Next Generation Lithography Mask Technology VII, 2000, Kanagawa, Japan

Abstract

Using a failure analysis-driven yield enhancements concept, based on an optimization of the mask manufacturing process and UV reticle inspection is studied and shown to improve the contact layer quality. This is achieved by relating various manufacturing processes to very fine tuned contact defect detection. In this way, selecting an optimized manufacturing process with fine-tuned inspection setup is achieved in a controlled manner. This paper presents a study, performed on a specially designed test reticle, which simulates production contact layers of design rule 250nm, 180nm and 150nm. This paper focuses on the use of advanced UV reticle inspection techniques as part of the process optimization cycle. Current inspection equipment uses traditional and insufficient methods of small contact-hole inspection and review.

Citation Download Citation

Shen Chung Kuo, Clare Wu, Yair Eran, Wolfgang Staud, Shirley Hemar, and Ofer Lindman "150-nm DR contact holes die-to-database inspection", Proc. SPIE 4066, Photomask and Next-Generation Lithography Mask Technology VII, (19 July 2000); https://doi.org/10.1117/12.392072

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