Paper
5 July 2000 0.32-μm pitch random line pattern formation by dense dummy pattern and double exposure in KrF wavelength
Shuji Nakao, Kouichirou Tsujita, Ichiriou Arimoto, Wataru Wakamiya
Author Affiliations +
Abstract
0.32 micrometers pitch on-grid random line pattern formation by double exposure in KrF wavelength is proposed based on optical image calculations. For first exposure, mask patterns are generated by combination of designed patterns and dense dummy patterns, al of which are laid out at on- grid positions with a pitch of 0.32 micrometers . An attenuated phase shift mask and an annular illumination are applied. The imaging performance is significantly enhanced because all patterns in this mask are categorized 'dense' with almost the same pitch of 0.32 micrometers . The mask pattern for second exposure are simply generated from the dummy patterns by tone inversion. The image size required for erasing dummy pattern in much larger than that for the first exposure. Consequently, large latitude, to erase the dummy pattern is much lager than that for the first exposure. Consequently, large latitude, to erase the dummy patterns and not to affect the designed patterns, can be obtained by conventional exposure method with low coherent illumination. Even in this method, OPC is required to obtain desirable CD. However, OPC in this method can be performed by simple rules based method, because on-grid restriction to layout much reduces the variation of pattern configuration. As a result, 0.32 micrometers pitch on-grid random line patterns are formed accurately with DOF larger than 0.6 micrometers in KrF wavelength.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shuji Nakao, Kouichirou Tsujita, Ichiriou Arimoto, and Wataru Wakamiya "0.32-μm pitch random line pattern formation by dense dummy pattern and double exposure in KrF wavelength", Proc. SPIE 4000, Optical Microlithography XIII, (5 July 2000); https://doi.org/10.1117/12.388949
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications and 3 patents.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photomasks

Optical proximity correction

Critical dimension metrology

Double patterning technology

Phase shifts

Lithographic illumination

Mask making

Back to Top