Techniques to print sub-0.2-um contact holes

Kayo Aramaki; T. Hamada; DongKwan Lee; Hiroshi Okazaki; Naoko Tsugama; Georg Pawlowski

doi:10.1117/12.388360

23 June 2000 Techniques to print sub-0.2-μm contact holes

Kayo Aramaki, T. Hamada, DongKwan Lee, Hiroshi Okazaki, Naoko Tsugama, Georg Pawlowski

Proceedings Volume 3999, Advances in Resist Technology and Processing XVII; (2000) https://doi.org/10.1117/12.388360
Event: Microlithography 2000, 2000, Santa Clara, CA, United States

Abstract

The present paper examines the applicability of three basic resist types (acetal, hybrid, t-butylester) to print sub-0.2 micrometer contact holes (C/H) using state-of-the-art illumination and processing techniques. In terms of ultimate resolution and DOF the acetal-based material showed the best performance under standard processing conditions, but exhibited serious limitations upon application of a half-tone phase-shift mask (HT-PSM) due to side-lobe formation. The hybrid material showed significantly better HT-PSM compatibility and -- due to an enhanced adaptability to practical thermal flow processes -- the best results upon application of a postbake to trigger thermally induced shrinkage. The t-butylester material usually performed second to the best under any selected illumination condition, and may be considered as top performer from a general point of view as no real show-stopper was observed. Thermal flow results of the hybrid material are discussed in more detail and briefly compared with alternate shrinking technologies, such as RELACS^TM or CARL^TM.

Citation Download Citation

Kayo Aramaki, T. Hamada, DongKwan Lee, Hiroshi Okazaki, Naoko Tsugama, and Georg Pawlowski "Techniques to print sub-0.2-μm contact holes", Proc. SPIE 3999, Advances in Resist Technology and Processing XVII, (23 June 2000); https://doi.org/10.1117/12.388360

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