Paper
21 July 2000 Lithographic performance and optimization of chemically amplified single-layer resists for EUV lithography
Takeo Watanabe, Hiroo Kinoshita, Atsushi Miyafuji, Shigeo Irie, Shigeru Shirayone, Shigeyasu Mori, Ei Yano, Hideo Hada, Katsumi Ohmori, Hiroshi Komano
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Abstract
The single layer chemically amplified resists are investigated for the extreme ultra-violet lithography. From the results of the sensitivity curve, the positive-tone resist of DP603 and the negative-tone resist of SAL601 have high sensitivities and high gamma values to the EUV exposure wavelength. Furthermore, by the optimization of both the dosage and the wafer focusing position, we succeed in replicating 0.056-micrometer-resist- pattern width on the exposure-field size of 10 mm X 1 mm on an 8-inches-diameter wafer. We confirm the resolution capability of the three-aspherical mirror imaging system that has been developed by the Himeji Institute of Technology.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takeo Watanabe, Hiroo Kinoshita, Atsushi Miyafuji, Shigeo Irie, Shigeru Shirayone, Shigeyasu Mori, Ei Yano, Hideo Hada, Katsumi Ohmori, and Hiroshi Komano "Lithographic performance and optimization of chemically amplified single-layer resists for EUV lithography", Proc. SPIE 3997, Emerging Lithographic Technologies IV, (21 July 2000); https://doi.org/10.1117/12.390100
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Cited by 8 scholarly publications.
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KEYWORDS
Extreme ultraviolet lithography

Semiconducting wafers

Chemically amplified resists

Lithography

Image resolution

Wafer-level optics

Mirrors

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