VCSEL arrays for 10-Gb/s multimode fiber optical interconnects

Rainer Michalzik; Roger King; Giorgio Giaretta; Roland Jaeger; Karl Joachim Ebeling

doi:10.1117/12.384391

27 April 2000 VCSEL arrays for 10-Gb/s multimode fiber optical interconnects

Rainer Michalzik, Roger King, Giorgio Giaretta, Roland Jaeger, Karl Joachim Ebeling

Proceedings Volume 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II; (2000) https://doi.org/10.1117/12.384391
Event: Symposium on Integrated Optoelectronics, 2000, San Jose, CA, United States

Abstract

In this paper, we report on some transmitter and optical fiber technologies for 10 Gb/s speed datacom systems. Primarily to enable direct flip-chip integration with silicon CMOS circuits for highly parallel interchip interconnects, we have fabricated 2D vertical-cavity surface-emitting laser arrays featuring 4*8 elements on a 250 micrometers pitch. Arrays emitting in the 980 nm spectral region exhibit excellent homogeneity and operation data like 0.8 mA threshold current, below 1.5 V threshold voltage, 1 mW output power at 2 mA current, and more than 35 percent conversion efficiency in the 2 to 5 mW power range. Bottom emission of 850 nm arrays is enabled by etching holes into the opaque GaAs substrate. Due to less efficient heat removal, devices are currently limited to about 2 mW light output at 6 mA current. Top-emitting 850 nm array elements have been employed for high-speed data transmission experiments. First we describe the characteristics of a new 50 micrometers core diameter silica multimode fiber that allows for 10 Gb/s data rate operation over a record distance of 1.6 km. Finally, a 9 Gb/s transmission experiment over 100 m length of a rather promising perfluorinated plastic optical fiber for low-cost data links is presented.

Citation Download Citation

Rainer Michalzik, Roger King, Giorgio Giaretta, Roland Jaeger, and Karl Joachim Ebeling "VCSEL arrays for 10-Gb/s multimode fiber optical interconnects", Proc. SPIE 3952, Optoelectronic Interconnects VII; Photonics Packaging and Integration II, (27 April 2000); https://doi.org/10.1117/12.384391

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available