Laser-based microscale bending for microelectronics fabrication

Xianfan Xu

doi:10.1117/12.387567

7 June 2000 Laser-based microscale bending for microelectronics fabrication

Xianfan Xu

Proceedings Volume 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V; (2000) https://doi.org/10.1117/12.387567
Event: Symposium on High-Power Lasers and Applications, 2000, San Jose, CA, United States

Abstract

This paper presents experimental and theoretical work on laser-based microscale bending. High precision bending of stainless steel and ceramic specimens is achieved with the use of a pulsed or a CW laser. Experiments are conducted to study the bending behavior of stainless steel and ceramics due to laser irradiation. The amount of bending is correlated with various laser and processing parameters. A theoretical model of the laser bending process is presented base don thermo-elasticity/plasticity. The laser bending process is explained as the result of the laser-induced non- uniform distribution of the residual strain. Numerical simulations are carried out to calculate the laser-induced temperature field, the residual stress field, and the amount of bending for both pulsed and CW laser irradiation. Applications of the laser bending technique in microelectronics fabrication are discussed.

Citation Download Citation

Xianfan Xu "Laser-based microscale bending for microelectronics fabrication", Proc. SPIE 3933, Laser Applications in Microelectronic and Optoelectronic Manufacturing V, (7 June 2000); https://doi.org/10.1117/12.387567

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