Simulation and properties of randomly switched control systems

Andrew G. Allison; Derek Abbott

doi:10.1117/12.368426

8 October 1999 Simulation and properties of randomly switched control systems

Andrew G. Allison, Derek Abbott

Proceedings Volume 3893, Design, Characterization, and Packaging for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.368426
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia

Abstract

Power electronics has made great advances since the introduction of the thyristor in 1958. Even a casual study of consumer electronics have steadily replaced passive circuits. Switched mode circuits can accommodate higher power densities, they are lighter, cheaper and easier to control. The use of microprocessors and microcontrollers can make switched mode circuits even more versatile. Unfortunately, there are some problems with switched mode circuits. The higher power densities handled by these circuits can cause catastrophic failure. Periodic switching can give rise to acoustic noise or undesirable electromagnetic radiation. These problems can be reduced through the use of random switching policies. One theoretical disadvantage of random switching policies is that the time averaged switched system is not strictly equivalent to the classical system with the same average parameters. The stability limits for the randomly switched and classical system are different. This is a possible area for concern, given the high power densities and the possibility of catastrophic failure. In this paper we examine the stability of randomly switched control systems. We provide simulations, some analysis and derive some practical rules for stability. We show that some randomness can be beneficial from the point of view of minimizing power spectral density of the noise waveforms in the output current.

Citation Download Citation

Andrew G. Allison and Derek Abbott "Simulation and properties of randomly switched control systems", Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); https://doi.org/10.1117/12.368426

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available