Paper
27 August 1999 Metal-fill optical test structures for improved chemical mechanical polishing
Shadi Alex AbuGhazaleh, Phillip Christie
Author Affiliations +
Abstract
This paper presents an iterative algorithm that merges the physical layout of a circuit with an optical test structure called a wire segment hologram. Wire segment holograms are geometrical patterns that resemble circuit wiring but are arranged to project an holographic image when illuminated with a light source whose wavelength is comparable to the feature size of the process under test. The quality of the projected image is strongly correlated with the fidelity of the fabrication process and therefore provides rapid, non-contact, dimensional metrology. We propose that the merged circuit/test structure is ideal for metal processing which suffers from high pattern dependence, such as chemical mechanical polishing. By changing the relative width, height and pitch of the merged diffractive elements, it is possible to generate test structures with a wide range of metal density. Thus, these test structures can perform the dual task of reducing pattern dependent defect formation and characterizing the dimensional fidelity of the fabrication process. Initial results are presented that indicate the merged circuit/test structures can resolve mask offset variations as small as 0.1 micrometer for a 2 micrometer wire width.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shadi Alex AbuGhazaleh and Phillip Christie "Metal-fill optical test structures for improved chemical mechanical polishing", Proc. SPIE 3884, In-Line Methods and Monitors for Process and Yield Improvement, (27 August 1999); https://doi.org/10.1117/12.361356
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KEYWORDS
Holograms

Image segmentation

Image processing

Fourier transforms

Optical testing

Chemical mechanical planarization

Diffraction

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