Reduced cost of ownership process for PECVD dielectric 1 and hardmask

Jonathon M. Lobbins; Leonard J. Olmer

doi:10.1117/12.361296

3 September 1999 Reduced cost of ownership process for PECVD dielectric 1 and hardmask

Jonathon M. Lobbins, Leonard J. Olmer

Proceedings Volume 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V; (1999) https://doi.org/10.1117/12.361296
Event: Microelectronic Manufacturing '99, 1999, Santa Clara, CA, United States

Abstract

Ceramic susceptors were retrofitted into the 200 mm Plasma Enhanced Chemical Vapor Deposition (PECVD) Dielectric toolsets to increase the Mean Time Before Failure (MTBF) caused by warping of the original Aluminum susceptors. Although the hardware retrofit resulted in a more stable deposition process, the within wafer uniformity remained consistently high. Designed experiments were performed and determined that the new Ceramic susceptors exhibited a uniformity signature that enabled the process to be optimized using electrode spacing. This process change resulted in a 20% uniformity improvement on both control and product wafers without adversely affecting Yield and IV parameters. Effects of the change on various other deposition parameters were also studied and determined to be minimal. After committee review, this process change was implemented on all PECVD Dielectric 1 toolsets and has been stable over time.

Citation Download Citation

Jonathon M. Lobbins and Leonard J. Olmer "Reduced cost of ownership process for PECVD dielectric 1 and hardmask", Proc. SPIE 3882, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V, (3 September 1999); https://doi.org/10.1117/12.361296

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