Analysis of manufacturing-scale MEMS reliability testing

Katya M. Delak; Paul Bova; Allyson L. Hartzell; David J. Woodilla

doi:10.1117/12.359367

18 August 1999 Analysis of manufacturing-scale MEMS reliability testing

Katya M. Delak, Paul Bova, Allyson L. Hartzell, David J. Woodilla

Proceedings Volume 3880, MEMS Reliability for Critical and Space Applications; (1999) https://doi.org/10.1117/12.359367
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

Long-term reliability of MEMS devices is increasingly important for large scale manufactured products. Traditional reliability testing used for microelectronic devices has been applied to integrated MEMS devices with the expectation that acceleration of MEMS-specific failure mechanisms would not be substantial. Rather, traditional package and circuit related failures would be accelerated. In addition, reliability tests that impart mechanical stresses on parts were expected to accelerate failures more so than traditional tests. It was found that while mechanical stresses were more effective in inducing MEMS related failures some traditional reliability tests did accelerate MEMS-related failures.

Citation Download Citation

Katya M. Delak, Paul Bova, Allyson L. Hartzell, and David J. Woodilla "Analysis of manufacturing-scale MEMS reliability testing", Proc. SPIE 3880, MEMS Reliability for Critical and Space Applications, (18 August 1999); https://doi.org/10.1117/12.359367

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