Development of silicon microcapacitive accelerometer for seismic measurement

Mitsutomo Nishizawa; Geunbae Lim; Hiroaki Niitsuma; Masayoshi Esashi

doi:10.1117/12.365691

15 October 1999 Development of silicon microcapacitive accelerometer for seismic measurement

Mitsutomo Nishizawa, Geunbae Lim, Hiroaki Niitsuma, Masayoshi Esashi

Proceedings Volume 3752, Subsurface Sensors and Applications; (1999) https://doi.org/10.1117/12.365691
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1999, Denver, CO, United States

Abstract

We have developed a high sensitive and wide-band micro capacitive accelerometer for subsurface seismic measurements by using the micro machining technique which enables to fabricate three-dimensional micro structure and to realize small-size, low-cost and high performance sensors or actuators. The silicon capacitive micro accelerometers, which are used in automobiles for suspension control, brake control and air bags, are potentially be used for subsurface seismic measurements. However the sensitivity and the bandwidth of existing sensors are insufficient to detect seismic waves. The micromachining technique which we employed includes photolithography, anisotropic etching, reactive ion etching and anodic bonding. Problems in the fabrication process such as sticking of silicon mass on the electrode, buckling of spring beams, and a problem due to the squeezed film dumping effect have been resolved by improving the sensor structure and the silicon process. Finally, we have evaluated the characteristics of the sensor.

Citation Download Citation

Mitsutomo Nishizawa, Geunbae Lim, Hiroaki Niitsuma, and Masayoshi Esashi "Development of silicon microcapacitive accelerometer for seismic measurement", Proc. SPIE 3752, Subsurface Sensors and Applications, (15 October 1999); https://doi.org/10.1117/12.365691

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