Electrodiffusion bonding of aluminum to glass

Piotr Mrozek; Tadeusz Lukaszewicz

doi:10.1117/12.344712

8 April 1999 Electrodiffusion bonding of aluminum to glass

Piotr Mrozek, Tadeusz Lukaszewicz

Proceedings Volume 3725, International Conference on Solid State Crystals '98: Epilayers and Heterostructures in Optoelectronics and Semiconductor Technology; (1999) https://doi.org/10.1117/12.344712
Event: International Conference on Solid State Crystals '98, 1998, Zakopane, Poland

Abstract

Strong Al-glass bonds are obtained by low temperature electrodiffusion process. The electric field used during formation of the bond allows to perform sealing in temperatures far below the softening point of the sodium silicate glass. The electric forces keep the joined surfaces of glass and Al in intimate contact during process, so there is no need to use external pressure to the joined parts. Bonding time is typically about 1 minute. Such parameters of bonding process allow to perform seals with no deformation of glass. The strength of electrodiffusion seals is about a typical value of bonds obtained by conventional methods. We propose structural model of the bonding process. Electron- microprobe studies, photo-electron spectroscopy and strength investigations were made to confirm the proposed model.

Citation Download Citation

Piotr Mrozek and Tadeusz Lukaszewicz "Electrodiffusion bonding of aluminum to glass", Proc. SPIE 3725, International Conference on Solid State Crystals '98: Epilayers and Heterostructures in Optoelectronics and Semiconductor Technology, (8 April 1999); https://doi.org/10.1117/12.344712

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