Modeling stresses in piezoelectric smart structures under combined thermal and mechanical excitations

Tamunoiyala S. Koko; Malcolm J. Smith; Irewole R. Orisamolu

doi:10.1117/12.350141

4 June 1999 Modeling stresses in piezoelectric smart structures under combined thermal and mechanical excitations

Tamunoiyala S. Koko, Malcolm J. Smith, Irewole R. Orisamolu

Proceedings Volume 3667, Smart Structures and Materials 1999: Mathematics and Control in Smart Structures; (1999) https://doi.org/10.1117/12.350141
Event: 1999 Symposium on Smart Structures and Materials, 1999, Newport Beach, CA, United States

Abstract

In this paper, the integrated finite element methodology developed in our earlier work for designing active vibration control strategies in smart structures, is extended to compute the stresses and strains in the structure, due to combined thermal, mechanical and electrical excitations. A layered composite brick elements with linear strain-displacement and linear thermopiezoelectric constitutive relations is used to model the structure. The method, which has been encoded into a software called SMARTCOM provides a design and analysis capability that simultaneously accounts for the coupled thermopiezoelectric and control capabilities of the smart structural systems. Numerical examples are provided for structures with surface bonded piezoelectric sensors and actuators, under various types of mechanical, thermal and electrical load. Comparisons are made to other available solutions to verify the accuracy of the SMARTCOM simulations. The method provides accurate results and is seen as a valuable tool for the design and analysis of these smart structures.

Citation Download Citation

Tamunoiyala S. Koko, Malcolm J. Smith, and Irewole R. Orisamolu "Modeling stresses in piezoelectric smart structures under combined thermal and mechanical excitations", Proc. SPIE 3667, Smart Structures and Materials 1999: Mathematics and Control in Smart Structures, (4 June 1999); https://doi.org/10.1117/12.350141

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