Direct mesoscopic simulation of melting and evaporation

Takashi Yabe

doi:10.1117/12.352672

15 July 1999 Direct mesoscopic simulation of melting and evaporation

Takashi Yabe

Proceedings Volume 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV; (1999) https://doi.org/10.1117/12.352672
Event: Optoelectronics '99 - Integrated Optoelectronic Devices, 1999, San Jose, CA, United States

Abstract

We have succeeded for the first time to simulate phase transition from metal to vapor. This success is due to the CIP method that can treat solid, liquid and gas together and can trace a sharp interface with almost one grid. For these types of problems such as welding and cutting processes, we need to treat topology and phase changes of the structure simultaneously. Furthermore, the grid system aligned to the solid or liquid surface has no meaning and sometimes the mesh is distorted and even broken up. The CIP method developed by the authors does not need adaptive grid systems and therefore removes the problems of grid distortion caused by structural break up and topology change. In this paper, we will give a brief introduction of the CIP method, then report here the application to laser-induced evaporation and welding process. In the former case, aluminum is evaporated well after the laser beam needed and evaporation occurs with a large angle to the target normal leading to large debris. In the latter case, a deep penetration welding of SUS304 by TAG laser has been successfully replicated the experiments and the simulation clarifies the formation mechanism of keyhole.

Citation Download Citation

Takashi Yabe "Direct mesoscopic simulation of melting and evaporation", Proc. SPIE 3618, Laser Applications in Microelectronic and Optoelectronic Manufacturing IV, (15 July 1999); https://doi.org/10.1117/12.352672

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