DUV pellicle quality assessment based on customer priorities

James L. Wood; Benjamin George Eynon Jr.; Franklin D. Kalk

doi:10.1117/12.332860

18 December 1998 DUV pellicle quality assessment based on customer priorities

James L. Wood, Benjamin George Eynon Jr., Franklin D. Kalk

Proceedings Volume 3546, 18th Annual BACUS Symposium on Photomask Technology and Management; (1998) https://doi.org/10.1117/12.332860
Event: 18th Annual BACUS Symposium on Photomask Technology and Management, 1998, Redwood City, CA, United States

Abstract

As semiconductor lithography wavelength decreases, pellicle quality becomes more crucial. Previously unprintable membrane defects are now more susceptible to printing, and pellicle film transmission variation may cause nonuniformity in printed feature size. Globally, five companies manufacture DUV film pellicles: DuPont, Exion, Mitsui, MLI, and Shinetsu. A report comparing these vendors' DUV pellicles is presented here. Each vendor provided ten 248 nm pellicles to be evaluated. Pellicle properties evaluated, in order of importance to several semiconductor manufacturers, were transmission uniformity, membrane cleanliness, frame cleanliness, membrane transmission (both on- and off-axis), adhesive uniformity/integrity, and frame width uniformity. Transmission properties were measured with a single beam spectrometer. Frame cleanliness, frame width uniformity, and adhesive integrity were inspected with a micrometer-stage microscope. Visual frame and membrane particle inspections were performed with a high intensity light followed by an automatic, laser-scattering particle inspection tool. None of the vendors passed the requirements provided by semiconductor manufacturers. Deficiencies were observed in membrane transmission, frame and membrane cleanliness, and adhesive integrity.

Citation Download Citation

James L. Wood, Benjamin George Eynon Jr., and Franklin D. Kalk "DUV pellicle quality assessment based on customer priorities", Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998); https://doi.org/10.1117/12.332860

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