Paper
1 June 1998 Laser-scanning vibrometry for defect analysis
Heinz Franke, Lothar Zipser
Author Affiliations +
Proceedings Volume 3411, Third International Conference on Vibration Measurements by Laser Techniques: Advances and Applications; (1998) https://doi.org/10.1117/12.307733
Event: Third International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, 1998, Ancona, Italy
Abstract
A novel method for identifying hidden defects in new products or in worn but valuable recyclable components is described. This method is based on the fact that the vibration behavior of mechanical objects is influenced by defects or material fatigue. For detecting hidden defects the vibration frame of the objects is scanned with a laser- scanning vibrometer. The scanned information is analyzed in an image processing unit. At last a quality evaluation is made.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heinz Franke and Lothar Zipser "Laser-scanning vibrometry for defect analysis", Proc. SPIE 3411, Third International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, (1 June 1998); https://doi.org/10.1117/12.307733
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Cited by 4 scholarly publications.
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KEYWORDS
Image processing

Vibrometry

Nondestructive evaluation

Defect detection

Image analysis

Laser processing

Computing systems

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