Paper
8 June 1998 Advanced surface inspection techniques for SOI wafers
Author Affiliations +
Abstract
In this paper, it is described that (1) Various type of SOI wafers have each optimum laser illumination mode, (2) Using this optimum laser illumination, 0.1 - 0.3 micrometer particle detection sensitivity has been achieved. (3) By measuring the noise element of scattered light from SOI surface, failure mode can be determined. The performance of the particle detection for each type of wafer and the result of surface roughness failure is also discussed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mari Nozoe, Aritoshi Sugimoto, and Takahide Ikeda "Advanced surface inspection techniques for SOI wafers", Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); https://doi.org/10.1117/12.308756
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications and 2 patents.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Particles

Inspection

Interference (communication)

Surface roughness

Thin films

Wafer inspection

RELATED CONTENT


Back to Top