X-ray exposures of electrodeposited photoresist for conformal lithography on corrugated surfaces

Frank T. Hartley; Chantal G. Khan Malek; Steven Nguyen

doi:10.1117/12.309615

5 June 1998 X-ray exposures of electrodeposited photoresist for conformal lithography on corrugated surfaces

Frank T. Hartley, Chantal G. Khan Malek, Steven Nguyen

Proceedings Volume 3331, Emerging Lithographic Technologies II; (1998) https://doi.org/10.1117/12.309615
Event: 23rd Annual International Symposium on Microlithography, 1998, Santa Clara, CA, United States

Abstract

Proximity printing using synchrotron x-ray lithography provides high resolution pattern transfer with large depth of field, low diffraction effects and no reflection form the substrate. Electro-plating of photo-resist allows deposition of thin, uniform films over geometrically complex and topographically diverse, electrically conductive surfaces. Two electro-deposited photoresists produced by Shipley, EAGLE 2100 ED negative tone and PEPR 2400 positive tone resist, have been tested with x-rays demonstrating micron pattern transfer over depths-of-field in fractions of millimeters.

Citation Download Citation

Frank T. Hartley, Chantal G. Khan Malek, and Steven Nguyen "X-ray exposures of electrodeposited photoresist for conformal lithography on corrugated surfaces", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309615

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