Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments

David M. Dozor

doi:10.1117/12.310668

16 June 1998 Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments

David M. Dozor

Author Affiliations +

Proceedings Volume 3326, Smart Structures and Materials 1998: Industrial and Commercial Applications of Smart Structures Technologies; (1998) https://doi.org/10.1117/12.310668
Event: 5th Annual International Symposium on Smart Structures and Materials, 1998, San Diego, CA, United States

Abstract

A magnetostrictive wire-bonding clamp for use in semiconductor packaging applications has been developed by Mechatronic Technology Co. Semiconductor industry trends, requiring high process throughput on increasing lead count packaging, make the magnetostrictive material Terfenol-D a candidate for this application. To construct this small, lightweight device, small samples of Terfenol-D were prepared by ETREMA Products, Inc. This paper reports the initial design, mathematical modeling, and experiments related to this initial prototype.

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David M. Dozor "Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments", Proc. SPIE 3326, Smart Structures and Materials 1998: Industrial and Commercial Applications of Smart Structures Technologies, (16 June 1998); https://doi.org/10.1117/12.310668

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