Micromachined field emitter arrays for application to FED

Myung-Hwan Oh

doi:10.1117/12.293563

14 November 1997 Micromachined field emitter arrays for application to FED

Myung-Hwan Oh

Proceedings Volume 3242, Smart Electronics and MEMS; (1997) https://doi.org/10.1117/12.293563
Event: Far East and Pacific Rim Symposium on Smart Materials, Structures, and MEMS, 1997, Adelaide, Australia

Abstract

The fundamental goal in FED technology is the ability to construct emitters that present high-electron-emission characteristics and reliability with a low turn-on voltage. Several types of micromachined field emitter arrays combining silicon/metal tips with diamond-like carbon (DLC) coating are fabricated and examined for their applications to FEDs. Although there are some fluctuations of initial conduction current due to the unstable electron emission from the sharp emitter tips, FEAs panel whose silicon/metal tips are coated with DLC film by PECVD and layer-by-layer deposition shows remarkably lowered threshold voltage with increased current density.

Citation Download Citation

Myung-Hwan Oh "Micromachined field emitter arrays for application to FED", Proc. SPIE 3242, Smart Electronics and MEMS, (14 November 1997); https://doi.org/10.1117/12.293563

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