Defect cluster analysis to detect equipment-specific yield loss based on yield-to-area calculations

Christopher Hess; Larg H. Weiland

doi:10.1117/12.284694

11 September 1997 Defect cluster analysis to detect equipment-specific yield loss based on yield-to-area calculations

Christopher Hess, Larg H. Weiland

Proceedings Volume 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III; (1997) https://doi.org/10.1117/12.284694
Event: Microelectronic Manufacturing, 1997, Austin, TX, United States

Abstract

Defect parameter extraction plays an important role in process control and yield prediction. A methodology of evaluating wafer level defect clustering will be presented to detect equipment specific particle contamination. For that, imaginary wafermaps of a variety of different chip areas are generated to calculate a yield-to-area dependency. Based on these calculations a Micro Density Distribution (MDD) will be determined for each wafer. The range and course of the MDD may indicate specific failures of equipment tools.

Citation Download Citation

Christopher Hess and Larg H. Weiland "Defect cluster analysis to detect equipment-specific yield loss based on yield-to-area calculations", Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); https://doi.org/10.1117/12.284694

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