Advanced PVD Ti/TiN liners for contact and via applications

Hans-Joachim Barth; J. Bierner; Hans Helneder; Werner K. Robl; K. Schober; Manfred Schneegans

doi:10.1117/12.284651

5 September 1997 Advanced PVD Ti/TiN liners for contact and via applications

Hans-Joachim Barth, J. Bierner, Hans Helneder, Werner K. Robl, K. Schober, Manfred Schneegans

Proceedings Volume 3214, Multilevel Interconnect Technology; (1997) https://doi.org/10.1117/12.284651
Event: Microelectronic Manufacturing, 1997, Austin, TX, United States

Abstract

The benefits of different advanced PVD methods for Ti/TiN films, collimated, longthrow and ionized PVD, are compared to conventional or standard magnetron sputtering with respect to future requirements. Special attention is given to integration aspects in combination with W- plugs and hot Al-fill techniques for contact applications. Besides basic film properties and step coverage data, electrical results for contacts are reported. The dependence of the contact resistance on the bottom Ti thickness is explained, and a new spiking model for Al-filled contacts is proposed. Finally specific manufacturing issues like throughput, target life time and defect densities will be addressed also.

Citation Download Citation

Hans-Joachim Barth, J. Bierner, Hans Helneder, Werner K. Robl, K. Schober, and Manfred Schneegans "Advanced PVD Ti/TiN liners for contact and via applications", Proc. SPIE 3214, Multilevel Interconnect Technology, (5 September 1997); https://doi.org/10.1117/12.284651

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