Photolithography simulation on nonplanar substrate using the finite-element method with absorbing boundary conditions

In-Ho Park; Hye-Keun Oh; S. B. Hyun

doi:10.1117/12.276037

7 July 1997 Photolithography simulation on nonplanar substrate using the finite-element method with absorbing boundary conditions

In-Ho Park, Hye-Keun Oh, S. B. Hyun

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Proceedings Volume 3051, Optical Microlithography X; (1997) https://doi.org/10.1117/12.276037
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

A method for simulating exposure, post exposure bake and development process is described and applied for analyzing the problem of reflective stepped substrate. The method is based on the numerical solver of Helmholtz equation and the rigorous boundary condition which considers the entire system consisted of projection optics, photoresist and substrate. Diffusion equation and the ray tracing model are used for simulating the post exposure bake and the development process, respectively. The developed photoresist pattern on the stepped reflective substrate topography are obtained, and it shows irregular resist profiles due to the reflection of light at the step edge.

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In-Ho Park, Hye-Keun Oh, and S. B. Hyun "Photolithography simulation on nonplanar substrate using the finite-element method with absorbing boundary conditions", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); https://doi.org/10.1117/12.276037

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