Structural integrity of smart laminates

Jin Min Zhang; Kim Seng Lee; Seng Guan Lee; Teck Boon Yeo

doi:10.1117/12.269856

20 March 1997 Structural integrity of smart laminates

Jin Min Zhang, Kim Seng Lee, Seng Guan Lee, Teck Boon Yeo

Proceedings Volume 2921, International Conference on Experimental Mechanics: Advances and Applications; (1997) https://doi.org/10.1117/12.269856
Event: International Conference on Experimental Mechanics: Advances and Applications, 1996, Singapore, Singapore

Abstract

The effects of embedded piezoceramic actuators and sensors on the structural integrity of the host laminated materials have been investigated using finite element analysis and fracture mechanics approach. Double cantilever beam and four point flexural tests were conducted on smart laminates with pre-set cracks to measure the fracture resistances at piezoceramic/laminate and interlaminar interfaces. A two- dimensional finite element code was developed to calculate the stress intensity factors for bi-material interface cracks. It was found that the mode I fracture resistances at piezoceramic/laminate interfaces varied from 3.64 to 4.72 Nmm^-3/2, much lower than both the mode I fracture resistances for interlaminar delamination which varies from 29.6 to 76.8 Nmm^-3/2 for different ply orientations and the mode I fracture resistances (34.8 approximately 53.8 Nmm^-3/2) for cracks inside the piezoceramic actuators. Therefore, the piezoceramic/laminate interface is the weakest interface where debonding may first start when out-of-plane actuation or load is applied.

Citation Download Citation

Jin Min Zhang, Kim Seng Lee, Seng Guan Lee, and Teck Boon Yeo "Structural integrity of smart laminates", Proc. SPIE 2921, International Conference on Experimental Mechanics: Advances and Applications, (20 March 1997); https://doi.org/10.1117/12.269856

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