Paper
13 September 1996 Temperature rise in thick PMMA resists during x-ray exposure
Harish M. Manohara, Gina M. Calderon, J. Michael Klopf, Kevin J. Morris, Olga Vladimirsky, Yuli Vladimirsky
Author Affiliations +
Proceedings Volume 2880, Microlithography and Metrology in Micromachining II; (1996) https://doi.org/10.1117/12.250950
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States
Abstract
Temperature measurements of thick PMMA resist during X-ray (1 to 5 keV) exposure are presented in this paper. Thin metal (gold) film thermal sensors were fabricated directly on the resist surface and on the resist/substrate interface using micro-lithography methods. The temperature measurements were conducted in vacuum (< 10-4 Torr) and in 1 to 25 Torr helium pressure--conditions corresponding to typically X-ray lithography exposure. The results of temperature rise measurements performed with thermal sensors and with miniature conventional thermocouples are compared.
© (1996) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Harish M. Manohara, Gina M. Calderon, J. Michael Klopf, Kevin J. Morris, Olga Vladimirsky, and Yuli Vladimirsky "Temperature rise in thick PMMA resists during x-ray exposure", Proc. SPIE 2880, Microlithography and Metrology in Micromachining II, (13 September 1996); https://doi.org/10.1117/12.250950
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Cited by 6 scholarly publications.
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KEYWORDS
Polymethylmethacrylate

Temperature metrology

Infrared sensors

X-rays

Helium

Photomasks

Gold

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