Electrodeposition of 3D microstructures without molds

Andreas Maciossek

doi:10.1117/12.251226

23 September 1996 Electrodeposition of 3D microstructures without molds

Andreas Maciossek

Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251226
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

A new fabrication process for the generation of 3D microstructures is presented. On the base of electrodeposition, microstructures of different 3D shapes could be formed without using molds. This method can be applied for realizing new components for surface micro machining. Furthermore, it can be used as an ad-on process to almost all process technologies and it make use of standard equipment. Also presented is a calculation of linearly increasing structures by the example of wedge shaped plans. The main idea of the new technology is the controlled overplating of patterned plating base sequences.

Citation Download Citation

Andreas Maciossek "Electrodeposition of 3D microstructures without molds", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); https://doi.org/10.1117/12.251226

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