Optimizing process and equipment efficiency using integrated methods

Michael J. D'Elia; Ted F. Alfonso

doi:10.1117/12.250896

13 September 1996 Optimizing process and equipment efficiency using integrated methods

Michael J. D'Elia, Ted F. Alfonso

Proceedings Volume 2876, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II; (1996) https://doi.org/10.1117/12.250896
Event: Microelectronic Manufacturing 1996, 1996, Austin, TX, United States

Abstract

The semiconductor manufacturing industry is continually riding the edge of technology as it tries to push toward higher design limits. Mature fabs must cut operating costs while increasing productivity to remain profitable and cannot justify large capital expenditures to improve productivity. Thus, they must push current tool production capabilities to cut manufacturing costs and remain viable. Working to continuously improve mature production methods requires innovation. Furthermore, testing and successful implementation of these ideas into modern production environments require both supporting technical data and commitment from those working with the process daily. At AMD, natural work groups (NWGs) composed of operators, technicians, engineers, and supervisors collaborate to foster innovative thinking and secure commitment. Recently, an AMD NWG improved equipment cycle time on the Genus tungsten silicide (WSi) deposition system. The team used total productive manufacturing (TPM) to identify areas for process improvement. Improved in-line equipment monitoring was achieved by constructing a real time overall equipment effectiveness (OEE) calculator which tracked equipment down, idle, qualification, and production times. In-line monitoring results indicated that qualification time associated with slow Inspex turn-around time and machine downtime associated with manual cleans contributed greatly to reduced availability. Qualification time was reduced by 75% by implementing a new Inspex monitor pre-staging technique. Downtime associated with manual cleans was reduced by implementing an in-situ plasma etch back to extend the time between manual cleans. A designed experiment was used to optimize the process. Time between 18 hour manual cleans has been improved from every 250 to every 1500 cycles. Moreover defect density realized a 3X improvement. Overall, the team achieved a 35% increase in tool availability. This paper details the above strategies and accomplishments.

Citation Download Citation

Michael J. D'Elia and Ted F. Alfonso "Optimizing process and equipment efficiency using integrated methods", Proc. SPIE 2876, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing II, (13 September 1996); https://doi.org/10.1117/12.250896

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