New assembly technique for deeply buried optical waveguides

Alain Mure-Ravaud; Serge Pelissier; Florent Pigeon; B. Biasse; Gregory Pandraud

doi:10.1117/12.246788

19 August 1996 New assembly technique for deeply buried optical waveguides

Alain Mure-Ravaud, Serge Pelissier, Florent Pigeon, B. Biasse, Gregory Pandraud

Proceedings Volume 2775, Specification, Production, and Testing of Optical Components and Systems; (1996) https://doi.org/10.1117/12.246788
Event: Optical Instrumentation and Systems Design, 1996, Glasgow, United Kingdom

Abstract

The growing demand for complex components for integrated- optic requires fabrication methods allowing good reproducibility and a minimized number of processing steps. The ion-exchange technique is attractive because it can be used to make inexpensive and versatile waveguides in glass. To ensure reliable operation, the waveguides have to be buried beneath the surface. Various methods for making buried waveguides are based on field assisted ion exchange with one or more steps in the procedure. We propose a new assembling method in which a buried optical waveguide is obtained by direct bonding of two separate waveguides. We found that direct bonding of preprocessed wafers is a useful and versatile step in the fabrication of integrated optical components. Wafer direct bonding is compatible with VLSI batch technology and device miniaturization therefore low cost combined with high performance can be achieved. Furthermore, a large variety of symmetrical or asymmetrical index profiles is possible and the method allows simultaneous fabrication of many identical optical components. Optical properties of the component are studied and the advantages of this new process are summarized and compared with other techniques.

Citation Download Citation

Alain Mure-Ravaud, Serge Pelissier, Florent Pigeon, B. Biasse, and Gregory Pandraud "New assembly technique for deeply buried optical waveguides", Proc. SPIE 2775, Specification, Production, and Testing of Optical Components and Systems, (19 August 1996); https://doi.org/10.1117/12.246788

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KEYWORDS

Waveguides

Semiconducting wafers

Wafer bonding

Integrated optics

Near field optics

Glasses

Ion exchange

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