Digital tester-based measurement methodology for process control in multilevel metallization systems

Christopher Hess; Larg H. Weiland

doi:10.1117/12.221308

19 September 1995 Digital tester-based measurement methodology for process control in multilevel metallization systems

Christopher Hess, Larg H. Weiland

Proceedings Volume 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing; (1995) https://doi.org/10.1117/12.221308
Event: Microelectronic Manufacturing '95, 1995, Austin, TX, United States

Abstract

The control of metallization layers' integrity gain more importance increasing the total number of metallization layers. Therefore, an electrical measurement procedure has to separate defectless test structure elements from faulty test structure elements. To decrease the number of test procedures and test equipment, this binary decision will be made parallel to the functional test of product chips using the same digital test system to measure test structure elements too. In addition, the geometrical arrangement of the test structure layout elements will also be transformed to binary description. As a result of this, novel algorithms will now enable the direct comparison of both binary data sets to extract test structure faults like opens and shorts as well as process specific defect parameters.

Citation Download Citation

Christopher Hess and Larg H. Weiland "Digital tester-based measurement methodology for process control in multilevel metallization systems", Proc. SPIE 2637, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing, (19 September 1995); https://doi.org/10.1117/12.221308

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