Advanced FIB applications for product analysis

Andrew Birnie; Andrew Beaumont; Chris Dodd; Grant McNeil

doi:10.1117/12.221448

22 September 1995 Advanced FIB applications for product analysis

Andrew Birnie, Andrew Beaumont, Chris Dodd, Grant McNeil

Proceedings Volume 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis; (1995) https://doi.org/10.1117/12.221448
Event: Microelectronic Manufacturing '95, 1995, Austin, TX, United States

Abstract

Focused Ion Beam (FIB) systems have become a workhorse of the modem semiconductor Product Analysis Lab. They have proved invaluable in applications like specific area cross-sectioning for defect identification and process control, for materials analysis sample preparation, for e-beam and mechanical probing preparation and for design debug and fix prototyping. New generation FIB systems, with increased beam current and control have enabled new applications of the tool. This paper aims to discuss these new applications but the data is presented as it was gathered, as a series of case studies, where a particular problem encountered was overcome by innovative use of the FIB.

Citation Download Citation

Andrew Birnie, Andrew Beaumont, Chris Dodd, and Grant McNeil "Advanced FIB applications for product analysis", Proc. SPIE 2635, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis, (22 September 1995); https://doi.org/10.1117/12.221448

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