Initial evaluation result of DNQ-novolak resist system for advanced e-beam reticle fabrication

Yasunori Yokoya; Hideo Kobayashi; Keishi Asakawa

doi:10.1117/12.228202

8 December 1995 Initial evaluation result of DNQ-novolak resist system for advanced e-beam reticle fabrication

Yasunori Yokoya, Hideo Kobayashi, Keishi Asakawa

Proceedings Volume 2621, 15th Annual BACUS Symposium on Photomask Technology and Management; (1995) https://doi.org/10.1117/12.228202
Event: 15th Annual BACUS Symposium on Photomask Technology and Management '95, 1995, Santa Clara, CA, United States

Abstract

Advanced e-beam reticle fabrication, including PS and OPC mask, has created a growing need for an alternative resist system with superior contrast, linearity and resolution, dry-etching capability. Some aqueous-based DNQ-novolak resist systems have been proposed, however, their sensitivity has not reached a practical level yet without utilizing active and strong developer chemicals that cause excess resist dissolution in un-exposed area, which should lead to inferiority in contrast, critical dimension and defect quality level. We have investigated a development technique for DNQ-novolak resist systems by looking at resist dissolution rate in unexposed area in order to gain higher sensitivity by increasing dissolution rate but with maintaining superior development uniformity and defect quality level. During the study, specific difficulties were observed over several DNQ-novolak resists, which were 'non- linearity of resist dissolution' that led to less development uniformity and 'local and sporadic anomaly in resist dissolution' that was the seed of eventual peculiar clear defect caused by spin-spray development. The details of our findings on specific difficulties observed with DNQ-novolak resists are described in this paper. An initial evaluation result in very basic features of AZ5200, EBR900-M1, and ZMP300 is also reported.

Citation Download Citation

Yasunori Yokoya, Hideo Kobayashi, and Keishi Asakawa "Initial evaluation result of DNQ-novolak resist system for advanced e-beam reticle fabrication", Proc. SPIE 2621, 15th Annual BACUS Symposium on Photomask Technology and Management, (8 December 1995); https://doi.org/10.1117/12.228202

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Reticles

Photoresist processing

Chromium

Etching

Neodymium

Coating

Manufacturing

Show All Keywords

Keywords/Phrases

Search In:

Publication Years