Paper
23 June 1995 Experimental and computational determination of dynamic characteristics of microbeam sensors
Gordon C. Brown, Ryszard J. Pryputniewicz
Author Affiliations +
Abstract
MicroElectromechanical Systems (MEMS) are devices fabricated with the techniques of microphotolithography to manufacture miniature actuators and sensors. Dimensions of MEMS devices are typically measured in microns. For a number of reasons, the current demand is to decrease the size of MEMS devices to submicron dimensions. However, the smaller MEMS become, the more challenging it is for engineers to measure with accuracy the static and dynamic characteristics of these devices. In this paper, electro-optic holography (EOH) and computational methods are used to study the resonant vibration behavior of submillimeter- sized cantilevered microbeam sensors. These particular sensors are probe tips made for atomic force microscopes. Important dynamic characteristics of these sensors, which must be verified experimentally, include the frequency of vibration and corresponding mode shapes, the quality factor (Q), the spring stiffness, and the vibrational amplitude. The EOH allows easy determination of these characteristics. Additionally, by performing phase measurements of an EOH image (magnified up to 100X), object displacements are determined. The finite element method (FEM) is used to model cantiliver beam dynamics in order to optimize such parameters as frequency of vibration, Q, spring sriffness, and amplitude of vibration. The FEM results are then compared to the EOH results and show acceptable correlation.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gordon C. Brown and Ryszard J. Pryputniewicz "Experimental and computational determination of dynamic characteristics of microbeam sensors", Proc. SPIE 2545, Interferometry VII: Applications, (23 June 1995); https://doi.org/10.1117/12.212636
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Cited by 12 scholarly publications.
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KEYWORDS
Finite element methods

Microelectromechanical systems

Sensors

Holography

Manufacturing

Data modeling

Signal detection

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