Paper
26 May 1995 Feature biasing versus feature-assisted lithography: a comparison of proximity correction methods for 0.5*(lambda/NA) lithography
Rainer Pforr, Kurt G. Ronse, Luc Van den Hove, Anthony Yen, Shane R. Palmer, Gene E. Fuller, Oberdan W. Otto
Author Affiliations +
Abstract
The effectiveness of two methods of optical proximity correction based on feature biasing and subresolution assisting features is compared by simulation and experiments. Parameters examined are overlapping focus- exposure windows for dense lines, semi-isolated and isolated lines, and line-end shortening. Binary and phase-shifting masks containing test and real IC design features are proximity corrected either by commercial software (in the case of feature biasing) or by manual correction using optimized size and placement of assisting features. The results indicate that, while both methods are effective in reducing optical proximity effects, the feature-assisted method is more advantageous in many cases.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rainer Pforr, Kurt G. Ronse, Luc Van den Hove, Anthony Yen, Shane R. Palmer, Gene E. Fuller, and Oberdan W. Otto "Feature biasing versus feature-assisted lithography: a comparison of proximity correction methods for 0.5*(lambda/NA) lithography", Proc. SPIE 2440, Optical/Laser Microlithography VIII, (26 May 1995); https://doi.org/10.1117/12.209249
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CITATIONS
Cited by 11 scholarly publications.
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KEYWORDS
Optical proximity correction

Photomasks

Lithography

Critical dimension metrology

Electroluminescence

Phase shifts

Binary data

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