Paper
9 June 1995 Thermal rearrangement of novolak resins used in microlithography
Ricky Hardy, Anthony Zampini, Michael J. Monaghan, Michael J. O'Leary, William J. Cardin, Timothy J. Eugster
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Abstract
Changes in phenolic-formaldehyde resin properties are described in terms of thermal exposure. At high temperature, resin molecular weight, dissolution properties and chemical composition change depending on the presence or absence of monomers. Without monomer in the resin melt at 220 degree(s)C, resin molecular weight increases with a corresponding decrease in dissolution rate. In the presence of monomer, molecular weight generally decreases. Dissolution rate may fluctuate depending on the monomer mixture. Three,five- Xylenol and 2,3,5-trimethylphenol co-monomers induced the most extreme changes in resin properties with thermal treatment. Resin degradation-recombination processes suggest a classical Friedel-Craft rearrangement mechanism.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ricky Hardy, Anthony Zampini, Michael J. Monaghan, Michael J. O'Leary, William J. Cardin, and Timothy J. Eugster "Thermal rearrangement of novolak resins used in microlithography", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); https://doi.org/10.1117/12.210390
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Cited by 1 scholarly publication.
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KEYWORDS
Carbon

Manufacturing

Optical lithography

Control systems

Manganese

Nitrogen

Calibration

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