Paper
9 June 1995 Profile defects in novolac/DNQ resists: I. formation of microgrooves
Peter Trefonas III, George P. Mirth, Michael J. Monaghan, Pamela Turci, L. DeJordy, Catherine C. Meister
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Abstract
The mechanisms of the formation of microgroove and protuberance defects in novolac/diazonaphthoquinone resists were studied and found to be influenced by the resist composition, the degree of substrate silylation, and the developer composition. Low molecular chains in the novolac polymer and high PAC contents promote the formation of microgrooves and protuberances. A mechanism is proposed wherein short polymer chains migrate toward the substrate interface and PAC migrates away from the substrate during post-bake; this migration enhances the dissolution rate near the substrate, leading to an undercut. The possibility that the migration of developer along the resist/substrate interface occurs through percolative diffusion is explored. Developer-induced hydrolysis of trimethylsilyl groups from the silylated substrate is shown to be a contributory mechanism in the formation of microgrooves. Adding select surfactants to the developer is shown to reduce the rate of substrate desilylation and inhibit microgroove formation.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter Trefonas III, George P. Mirth, Michael J. Monaghan, Pamela Turci, L. DeJordy, and Catherine C. Meister "Profile defects in novolac/DNQ resists: I. formation of microgrooves", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); https://doi.org/10.1117/12.210345
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Cited by 2 scholarly publications.
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KEYWORDS
Interfaces

Picture Archiving and Communication System

Polymers

Semiconducting wafers

Silicon

Head-mounted displays

Lithography

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