Paper
15 July 1994 General analysis of infrared focal plane array performance versus focal plane array operating temperature, number of TDI elements, diode area and cut-off wavelength
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Abstract
IR systems require more and more performance (high sensitivity, resolution,...) to be adapted to specific system applications (such as surveillance and tracking systems...). To achieve such requirements, IRFPA manufacturers have to perform tradeoffs involving many parameters such as FPA operating temperature, number of TDI elements, cutoff wavelength, and diode area. IRFPA technologies and system limitations must be taken into account for these analyses. Thus, the authors present the general analysis of effects of these parameters on Sofradir IRFPA performance mainly utilizing 8 to 12 micron spectral band mercury cadmium telluride detector arrays. Impacts on electro-optical performance parameters and on thermal characteristics are presented. For example TDI linear scanning arrays are analyzed with emphasis on high IRFPA performance based on existing IRFPA technologies. Advantages of choices of different IRFPA configurations are presented.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jean-Pierre Chatard, Philippe M. Tribolet, and Patricia Costa "General analysis of infrared focal plane array performance versus focal plane array operating temperature, number of TDI elements, diode area and cut-off wavelength", Proc. SPIE 2225, Infrared Detectors and Focal Plane Arrays III, (15 July 1994); https://doi.org/10.1117/12.179717
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KEYWORDS
Staring arrays

Diodes

Infrared radiation

Detector arrays

Electro optics

Infrared imaging

Manufacturing

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