Focusing and leveling based on wafer surface profile detection with interferometry for optical lithography

Masahiro Watanabe; Yoshitada Oshida; Yasuhiko Nakayama; Minoru Yoshida; Ryuichi Funatsu; Akira Fujii; Taku Ninomiya

doi:10.1117/12.175490

17 May 1994 Focusing and leveling based on wafer surface profile detection with interferometry for optical lithography

Masahiro Watanabe, Yoshitada Oshida, Yasuhiko Nakayama, Minoru Yoshida, Ryuichi Funatsu, Akira Fujii, Taku Ninomiya

Proceedings Volume 2197, Optical/Laser Microlithography VII; (1994) https://doi.org/10.1117/12.175490
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

A new concept of shot-by-shot leveling for high resolution stepper systems, profile-based- leveling, is presented. This detects the wafer surface profile using laser interferometry. From the detected profile, this system determines where on the LSI chip to focus, and controls the wafer stage for focusing and leveling. With an experimental setup, a profile detection repeatability of +/- 0.02 micrometers , a tilt measurement repeatability of +/- 0.24 (mu) rad and a tilt measurement linearity of +/- 1.4 (mu) rad were obtained.

Citation Download Citation

Masahiro Watanabe, Yoshitada Oshida, Yasuhiko Nakayama, Minoru Yoshida, Ryuichi Funatsu, Akira Fujii, and Taku Ninomiya "Focusing and leveling based on wafer surface profile detection with interferometry for optical lithography", Proc. SPIE 2197, Optical/Laser Microlithography VII, (17 May 1994); https://doi.org/10.1117/12.175490

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