Materials evaluation of antireflective coatings for single-layer 193-nm lithography

Roderick R. Kunz; Robert D. Allen

doi:10.1117/12.175358

16 May 1994 Materials evaluation of antireflective coatings for single-layer 193-nm lithography

Roderick R. Kunz, Robert D. Allen

Proceedings Volume 2195, Advances in Resist Technology and Processing XI; (1994) https://doi.org/10.1117/12.175358
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

A survey of optical constants for a variety of materials measured at 193 nm suggests that antireflection measures will be necessary for single-layer resist lithography at 193 nm. The extent to which standing waves occur in 193- nm resists is similar in magnitude to those occurring at 248 nm. To help reduce these effects, a new spin-on antireflective layer has been developed. It is composed of a polymeric dye in a phase-compatible blend with a transparent base polymer, can be thermally cured to render it insoluble, and is compatible with chemically amplified resists. In addition to this spin-on material, extension of existing 248-nm dry-deposited antireflective layers to 193 nm should allow for either spin-on or dry-deposited antireflection coatings for 193-nm lithography.

Citation Download Citation

Roderick R. Kunz and Robert D. Allen "Materials evaluation of antireflective coatings for single-layer 193-nm lithography", Proc. SPIE 2195, Advances in Resist Technology and Processing XI, (16 May 1994); https://doi.org/10.1117/12.175358

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