Overlay measurement and analysis of x-ray/optical lithography for mix-and-match device applications

Arnold W. Yanof; Kevin D. Cummings; Philip A. Seese; Matthew A. Thompson; Mark Drew Jr.; Daniel J. DeMay; James M. Oberschmidt; Robert H. Fair; Angela C. Lamberti

doi:10.1117/12.175807

13 May 1994 Overlay measurement and analysis of x-ray/optical lithography for mix-and-match device applications

Arnold W. Yanof, Kevin D. Cummings, Philip A. Seese, Matthew A. Thompson, Mark Drew Jr., Daniel J. DeMay, James M. Oberschmidt, Robert H. Fair, Angela C. Lamberti

Author Affiliations +

Proceedings Volume 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV; (1994) https://doi.org/10.1117/12.175807
Event: SPIE's 1994 Symposium on Microlithography, 1994, San Jose, CA, United States

Abstract

A joint Motorola/IBM experiment was performed in mix-and-match lithography across widely separated locations. A simple pattern placement metrology data set was created, and x-ray masks were manufactured according to this data. The same data was converted into a 5x reticle and optically stepped on wafers. The x-ray mask was designed to print upon two optical fields with one x-ray exposure. The x-ray mask was aligned to the wafers to produce box-in- box images for overlay metrology. The main overlay problems encountered were systematic offsets between x-ray and optical images, and average magnification error of approximately 8 ppm. The magnification error is substantial because of the 3 degree(s)C temperature difference between the optical stepper stage and the x-ray mask-writer. In an actual device run, the magnification differences will be removed by compensation in the e-beam writing of the x-ray mask. Offsets will be removed by use of a send-ahead wafer to determine the correct offset alignment in the x-ray stepper.

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Arnold W. Yanof, Kevin D. Cummings, Philip A. Seese, Matthew A. Thompson, Mark Drew Jr., Daniel J. DeMay, James M. Oberschmidt, Robert H. Fair, and Angela C. Lamberti "Overlay measurement and analysis of x-ray/optical lithography for mix-and-match device applications", Proc. SPIE 2194, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing IV, (13 May 1994); https://doi.org/10.1117/12.175807

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