Yield and reliability of laser-formed vertical links

Hans-Dieter Hartmann; Thomas Hillmann-Ruge

doi:10.1117/12.156519

15 September 1993 Yield and reliability of laser-formed vertical links

Hans-Dieter Hartmann, Thomas Hillmann-Ruge

Proceedings Volume 2090, Multilevel Interconnection: Issues That Impact Competitiveness; (1993) https://doi.org/10.1117/12.156519
Event: Microelectronic Processing '93, 1993, Monterey, CA, United States

Abstract

Vertical links have been processed by application of Q-switched Nd:YAG and Excimer Laser pulses. Investigations were carried out on three different standard CMOS double level metallizations (LS1-LS3). Experimental yield Y_R, contact resistance R_K, their mean R_m and related standard deviations (sigma) _R were obtained from special test structures: contact interconnect (CI) system connected by probe pads and CBKR chains. Simple expanded interconnections of sizes 10 X 10 micrometers ² (10²), 14², and 20² (LS3: 9.6², 12.6², and 19.5²) turned out to be best suitable. In yield evaluation, R_K > 3(Omega) was treated as a failure. Nd:YAG processing gave 100% Y_R for 14², 20², and 19.5² antifuses. Excimer laser processing of LS2 resulted in 100% Y_R for 14² and 20² antifuses, 12.6²-antifuses of LS3 could be connected with Y_R of 99.5%. Conventional accelerated life time tests were carried out on contact chains of LS1 and LS3. For LS3, E_A and n were determined with TRACE.

Citation Download Citation

Hans-Dieter Hartmann and Thomas Hillmann-Ruge "Yield and reliability of laser-formed vertical links", Proc. SPIE 2090, Multilevel Interconnection: Issues That Impact Competitiveness, (15 September 1993); https://doi.org/10.1117/12.156519

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