Improvements in two-dimensional X/Y metrology on photomasks and wafers

John M. Whittey

doi:10.1117/12.167258

15 February 1994 Improvements in two-dimensional X/Y metrology on photomasks and wafers

John M. Whittey

Proceedings Volume 2087, 13th Annual BACUS Symposium on Photomask Technology and Management; (1994) https://doi.org/10.1117/12.167258
Event: 13th Annual BACUS Symposium on Photomask Technology and Management, 1993, Santa Clara, CA, United States

Abstract

Recently Leica introduced a new X/Y Metrology system called the LMS 2020. Performance results indicate an approximate 30% improvement over the existing model--the LMS 2000. Through-put, design grid accuracy, and precision have all been incrementally improved to varying degrees. Information presented includes: brief background description of the tool, a description of the measurement algorithms used to obtain the data, and the specific performance results obtained through measurements on both photomasks and wafers.

Citation Download Citation

John M. Whittey "Improvements in two-dimensional X/Y metrology on photomasks and wafers", Proc. SPIE 2087, 13th Annual BACUS Symposium on Photomask Technology and Management, (15 February 1994); https://doi.org/10.1117/12.167258

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